Etching is a technique that removes materials by chemical reaction or physical impact. Etching technology can be divided into two categories: wet etching and dry etching. Etching is usually referred to as photochemical etching, which refers to the removal of the protective area to be etched after exposure and development, and the contact with chemical solution during etching to achieve the effect of dissolution and corrosion, forming a concave-convex or hollow-out molding effect.
It was first used to make printing convex-convex plates such as copper plates and zinc plates. It is also widely used to reduce the weight of instrument panels, famous brands and thin workpieces that are difficult to process by traditional processing methods. After continuous improvement and development of process equipment, it can also be used for the processing of precision etching products of electronic thin-film parts in aviation, machinery and chemical industries. Especially in semiconductor processes, etching is an indispensable technology. For example, the keyboard, text and symbols of Moto V3 are all formed by hollow etching technology. Etching paintings are made using etching technology.
Metal etching is a new chemical cutting method. This special chemical cutting method has made outstanding contributions to the development of modern human science and technology. The main fields of metal etching processing are: 1. In the cutting-edge aerospace industry, chemical cutting has become the standard processing method for manufacturing large-scale integral structures such as aircraft, outer space vehicles, missiles, etc.; 2. In the modern electronics industry, especially in the production of various integrated chips, chemical cutting is irreplaceable by other processing methods; 3. In the ordinary civilian field, more and more electronic casings, instrument panels, nameplates, etc. are made using chemical corrosion processing methods to improve the decorativeness and grade of their products and enhance their competitiveness in the market.